发明名称 VIBRATION MODULE FOR SOUND TRANSDUCER
摘要 The present invention relates to a vibration module for a sound transducer and, more particularly, to a vibration module for a sound transducer which can prevent sound leakage by minimizing contacts between a diaphragm and a voice coil. The vibration module for the sound transducer according to the present invention comprises: a substrate having an inner portion and an outer portion, an electrical connection portion for applying electrical signals to a voice coil being provided on the inner portion and a terminal being provided on the outer portion, for performing electrical connection between the electrical connection portion and the terminal; a first diaphragm attached between the inner portion and outer portion of the substrate; and the voice coil mounted on the inside of the inner portion of the substrate with a certain distance from the first diaphragm and electrically connected to the electrical connection portion.
申请公布号 US2014119578(A1) 申请公布日期 2014.05.01
申请号 US201314063605 申请日期 2013.10.25
申请人 EM-TECH. CO., LTD. 发明人 CHOI KYU DONG;PARK KIL DONG;JEONG IN HO;KWON JOONG HAK
分类号 H04R1/00 主分类号 H04R1/00
代理机构 代理人
主权项
地址