发明名称 STRUCTURES AND METHODS FOR DETERMINING TDDB RELIABILITY AT REDUCED SPACINGS USING THE STRUCTURES
摘要 A structure for TDDB measurement, a method determining TDDB at reduced spacings. The structure includes an upper dielectric layer on a top surface of a lower dielectric layer, a bottom surface of the upper dielectric layer and the top surface of the lower dielectric layer defining an interface; a first wire formed in the lower dielectric layer; a second wire formed in the upper dielectric layer; and wherein a distance between the first wire and the second wire measured in a direction parallel to the interface is below the lithographic resolution limit of the fabrication technology.
申请公布号 US2014118020(A1) 申请公布日期 2014.05.01
申请号 US201213664903 申请日期 2012.10.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FILIPPI RONALD G.;KALTALIOGLU ERDEM;LUSTIG NAFTALI E.;WANG PING-CHUAN;ZHANG LIJUAN
分类号 G01R31/26;H01L23/48 主分类号 G01R31/26
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