| 摘要 |
A connecting structure between circuit boards and a battery pack having the same. A hot bar does not make a direct contact with a circuit pattern of a flexible printed circuit board while soldering the flexible printed circuit board to a rigid printed circuit board, thereby preventing the damage to the circuit pattern and preventing electric short between a plurality of the circuit patterns due to the solder. During a soldering process, a base insulating layer having glass transition temperature (Tg) higher than a reflow temperature of the solder is arranged between the circuit pattern and the hot bar, the base insulating layer being perforated by a plurality of apertures to allow heat from the hot bar to more efficiently reach the circuit pattern and the solder. In addition, the circuit pattern covers the apertures, so that solder is unable to reach the hot iron. |
