发明名称 Low Inductance Flex Bond with Low Thermal Resistance
摘要 A electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.
申请公布号 US2014118966(A1) 申请公布日期 2014.05.01
申请号 US201213662659 申请日期 2012.10.29
申请人 LSI CORPORATION 发明人 LATURELL DONALD R.;ABDELLI SAID E.;KISS PETER;MACDONALD JAMES F.;WILSON ROSS S.
分类号 H05K1/02;H05K3/30 主分类号 H05K1/02
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