THERMOSETTING RESIN COMPOSITION

摘要

The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups (B) a linear organopolysiloxane compound having an SiH group only at one end (C) a silane coupling agent having an epoxy group (D) a Pt catalyst