METHOD FOR THE METALLIZATION OF BLIND VIAS

摘要

The invention relates to a method for the metallization of blind vias that are incorporated in a substrate used to set up three-dimensional micro-electronic circuits. According to said method, the substrate comprising the blind vias is either inherently catalytically active or is seeded with a catalytically active material and is subsequently at least partially metallized in a metallization bath by electroless deposition. Mechanical force impacts are applied to the metallization bath comprising the substrate, in such a way that the resulting acceleration acts in the direction of the opening of the blind vias, leading to improved fluid transport in the blind vias and to the expulsion of gas bubbles.