发明名称 RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a photo- or heat-curable resin composition having a sufficiently long pot life.SOLUTION: There is provided a resin composition which comprises: (A) an acrylic resin; (B) a thiol compound, (C) a latent curing agent; (D) a radical polymerization inhibitor; and (E) an anionic polymerization suppressor. The resin composition further preferably contains (F) a radical polymerization initiator and preferably contains (G) a compound other than an acrylic resin having two or more double bonds.</p>
申请公布号 JP2014077024(A) 申请公布日期 2014.05.01
申请号 JP20110150872 申请日期 2011.07.07
申请人 NAMICS CORP 发明人 IWATANI KAZUKI
分类号 C08G75/04;C08G59/02;C09J11/06;C09J109/00;C09J133/00;C09K3/10 主分类号 C08G75/04
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