| 摘要 |
A method for manufacturing a printed wiring board includes fixing a lower metal foil on a support plate, forming a lower insulating layer on the lower metal foil, laminating a core metal layer on the lower insulating layer, patterning the core metal layer such that the core metal layer is formed into a core conductive layer, forming an upper insulating layer on the core conductive layer and lower insulating layer, laminating an upper metal foil on the upper insulating layer, removing the plate from the lower foil such that a core substrate including the lower metal foil, lower insulating layer, core conductive layer, upper insulating layer and upper metal foil is formed, and forming on the core substrate a buildup layer including an insulating layer and a conductive layer. The core metal layer has a thickness which is set to be greater than thicknesses of the lower and upper foils. |
