PRODUCTION OF MICRO-MECHANICAL DEVICES

摘要

A method for fabrication of a device (206) from a wafer (170) of semiconductor material includes locally thinning the wafer in an area of the device to a predefined thickness by removing the semiconductor material from at least a first side of the wafer using a wet etching process, and etching through the thinned wafer in the area of the device so as to release a moving part (202) of the device. Other methods and systems for fabrication are also described.