EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING EPOXY RESIN CURED PRODUCT, AND SEMICONDUCTOR DEVICE

摘要

Provided are: an epoxy resin composition which is capable of providing a cured product that has excellent heat resistance, thermal decomposition stability and mechanical strength retention ability, while exhibiting excellent fluidity during molding, and which is suitable for power device sealing materials; and a method for producing an epoxy resin cured product. An epoxy resin composition which contains an epoxy resin represented by general formula (1), a phenolic curing agent, a curing catalyst and an inorganic filler, and which has an exothermic peak temperature of 150°C or more as determined by differential scanning calorimetry at a heating rate of 10°C/minute; and a method for producing an epoxy resin cured product, wherein the epoxy resin composition is molded at a temperature of from 100°C to 200°C and then subjected to post curing at a temperature of from 200°C to 300°C. (In the formula, n represents an average that is 0.2-4.0; and G represents a glycidyl group.)