SEMICONDUCTOR DEVICE WHERE MULTIPLE SEMICONDUCTOR CHIPS OF DIFFERENT SIZES ARE LAMINATED, AND MULTI-CHIP PACKAGE COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device where multiple semiconductor chips of different sizes are laminated, and a multi-chip package comprising the semiconductor device.SOLUTION: The semiconductor device of the invention includes a first chip and at least one chip that is laminated on the first chip and different in size from the first chip. The first chip comprises a plurality of first pads arranged in the center, and the at least one chip comprises a plurality of second pads arranged in the center. The first chip and the at least one chip are electrically connected using the first pad that is vertically arranged. The first pad and the second pad are arranged in the same sequence as the first chip and the at least one chip.