| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a highly reliable hermetically sealing structure in a short time.SOLUTION: A first sealing frame 16 formed on a main substrate 12 and a second sealing frame 19 formed on a lid substrate 13 are both configured from a Ni film. For example, a Bi layer 26 and a Au layer 27 are formed on the first sealing frame 16 and the second sealing frame 19 in advance, respectively. The first sealing frame 16 and the second sealing frame 19 are pressurized in a direction becoming closer to each other and are heated for 10 seconds at a temperature of 300°C, to form a junctional section 24 joining the first sealing frame 16 and the second sealing frame 19 together. The junctional section 24 may be configured by having a mixed layer 28 composed mainly of an alloy in which Ni-Bi-Au ternary compound alloy and AuBi alloy coexist, or configured by having a ternary compound alloy layer composed mainly of Ni-Bi-Au ternary compound alloy.</p> |
