发明名称 METHOD OF FORMING METAL GATE
摘要 Provided is a method of forming a metal gate including the following steps. A dielectric layer is formed on a substrate, wherein a gate trench is formed in the dielectric layer and a gate dielectric layer is formed in the gate trench. A first metal layer is formed in the gate trench by applying a AC bias between a target and the substrate during physical vapor deposition. A second metal layer is formed in the gate trench by applying a DC bias between the target and the substrate during physical vapor deposition.
申请公布号 US2014120711(A1) 申请公布日期 2014.05.01
申请号 US201213661998 申请日期 2012.10.26
申请人 UNITED MICROELECTRONICS CORP. 发明人 TSAI MIN-CHUAN;HUANG HSIN-FU;HSU CHI-MAO;CHENG TSUN-MIN;CHEN CHIEN-HAO;CHEN WEI-YU;SUN CHI-YUAN
分类号 H01L21/283 主分类号 H01L21/283
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