发明名称 Power Semiconductor Module and Power Converter Using the Same
摘要 A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.
申请公布号 US2014118934(A1) 申请公布日期 2014.05.01
申请号 US201214126955 申请日期 2012.06.15
申请人 TOKUYAMA TAKESHI;NAKATSU KINYA;SAITO RYUICHI;SATOH TOSHIYA;SUWA TOKIHITO;HITACHI AUTOMOTIVE SYSTEMS, LTD. 发明人 TOKUYAMA TAKESHI;NAKATSU KINYA;SAITO RYUICHI;SATOH TOSHIYA;SUWA TOKIHITO
分类号 H05K7/20 主分类号 H05K7/20
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