发明名称 |
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers. |
申请公布号 |
US2014116753(A1) |
申请公布日期 |
2014.05.01 |
申请号 |
US201313745047 |
申请日期 |
2013.01.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE HAN UL;LEE YONG SAM;AHN SUK HWAN |
分类号 |
H05K3/46;H05K1/02 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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