发明名称
摘要 A method and system for patterning a substrate using a radiation-sensitive material is described. The method and system include forming a layer of radiation-sensitive material on a substrate, exposing the layer of radiation-sensitive material to a pattern of radiation, and then performing a post-exposure bake following the exposing. The imaged layer of radiation-sensitive material is then developed to remove either a region having high radiation exposure or a region having low radiation exposure to form radiation-sensitive material lines. An exposure gradient within the radiation-sensitive material lines is then removed, followed by slimming the radiation-sensitive material lines.
申请公布号 JP2014510954(A) 申请公布日期 2014.05.01
申请号 JP20140502631 申请日期 2012.03.21
申请人 发明人
分类号 G03F7/40;G03F7/038;G03F7/039;G03F7/32;G03F7/38;H01L21/027 主分类号 G03F7/40
代理机构 代理人
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