发明名称 |
FLIP CHIP LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A flip chip light emitting device (LED) package and a manufacturing method thereof are provided. The flip chip LED package includes a package substrate including a cavity that exposes a circuit pattern, and a chip mounting portion disposed on a bottom surface of the cavity; a solder layer disposed on the circuit pattern; a bonding tape layer disposed on the chip mounting portion; and an LED including a bonding object region and a plurality of electrode pads disposed on one surface, being mounted on the package substrate such that the plurality of electrode pads are bonded to the solder layer and the bonding object region is bonded to the bonding tape layer |
申请公布号 |
US2014120641(A1) |
申请公布日期 |
2014.05.01 |
申请号 |
US201414148365 |
申请日期 |
2014.01.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM KWON JOONG;PAEK HO SUN;KIM HAK HWAN |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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