发明名称 PACKAGE SYSTEM WITH COVER STRUCTURE AND METHOD OF OPERATION THEREOF
摘要 A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.
申请公布号 US2014118908(A1) 申请公布日期 2014.05.01
申请号 US201314055549 申请日期 2013.10.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 GREGG JUSTIN L.;ROSENBLATT MICHAEL;VALLEJO ALEJANDRO ENRIQUE;AIMI ROBERTO M.;BEENE JEFF;LEE JI-YEON
分类号 H05K7/02 主分类号 H05K7/02
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