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发明名称
PACKAGE SYSTEM WITH COVER STRUCTURE AND METHOD OF OPERATION THEREOF
摘要
A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.
申请公布号
US2014118908(A1)
申请公布日期
2014.05.01
申请号
US201314055549
申请日期
2013.10.16
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
GREGG JUSTIN L.;ROSENBLATT MICHAEL;VALLEJO ALEJANDRO ENRIQUE;AIMI ROBERTO M.;BEENE JEFF;LEE JI-YEON
分类号
H05K7/02
主分类号
H05K7/02
代理机构
代理人
主权项
地址
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