| 摘要 |
This semiconductor device has: a first semiconductor chip, which does not include a peripheral circuit but includes a memory element, and which is provided with a first function; a first connecting terminal that is provided in the first semiconductor chip; a second semiconductor chip, which does not include a memory element but includes a peripheral circuit, and which is provided with a second function; and a second connecting terminal that is provided in the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are laminated each other by having the first connecting terminal and the second connecting terminal in contact with each other. |
