| 摘要 |
Routing building block for complex MID structures in hearing instruments The invention relates to hearing instruments. An objective of the invention is to use MID (Molded Interconnect Device) to replace the complexly folded and expensive flexible PCB (Printed Circuit Board) inside hearing aids. It is a further objective of the invention to enable use of com- plex MID frames in hearing instruments. To solve these problems an additional routing building block is provided for the very complex routing around active electronic components, e.g. chip or ASIC, and small passive electronic components. It is comprised of a small, preferably rigid mini PCB provided for the complex routing. So the large Flex-PCB is replaced by a combination of MID circuit frame and mini PCB. In this combination the mini PCB enables complex routing of conduct- ing paths and thus helps to increase integration while the MID circuit frame provides for a mechanical structure that enables and alleviates placing and connecting of components like microphones or receivers at the respective mounting positions, e.g. at openings of the hearing aid housing. |
