| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive paste having sufficient adhesion strength and insulating property even when the temperature upon thermal compression bonding is low (for example, at 180°C or lower).SOLUTION: The anisotropic conductive paste comprises (A) a thermoplastic resin, (B) a (meth)acrylate reactive diluent having one unsaturated double bond in one molecule, (C) a radical polymerization initiator, (D) an activator having one or more carboxyl groups in one molecule, and (E) solder powder. The (B) (meth)acrylate reactive diluent having one unsaturated double bond in one molecule is at least one selected from the group consisting of 2-hydroxy-3-phenoxypropyl acrylate and tetrahydrofurfuryl acrylate. |
