| 摘要 |
A method for producing at least one semi-conductive structure (130) on the surface (105) of a support (100) of which the surface comprises silicon. The method comprises the steps consisting of providing the support (100), forming, in contact with an area (101) of the surface (105), called the formation area, a layer (120) of a first material, the remainder (102) of the surface (105), called the free area, remaining free of the first material, the dimensions of the formation area (101) and the first material being suitable for forming the structure (130), the first material comprising gallium, the formation of said layer (120) taking place at a temperature lower than 600°C, and of forming the structure (130) in contact with the layer (120). |
