| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for an electronic component excellent in terms of coatability, yielding a favorable post-coating shape retainability, and capable of inhibiting voids and to provide a method for manufacturing a semiconductor chip package using the adhesive for an electronic component.SOLUTION: The provided adhesive for an electronic component is an adhesive for an electronic component including a curable compound, a curative, a curing accelerator, and an inorganic filler and having the following characteristics: in a case where the viscosity thereof measured at 5 rpm by using an E-type viscometer at 25°C is defined as A1 (Pa s) and the corresponding viscosity at 0.5 rpm as A2 (Pa s), A1 and A2/A1 are confined within a range surrounded by unbroken lines in Figure 1; the respective mixing ratios of the curative and the inorganic filler with respect to 100 pts.wt. of the curable compound are 5-150 pts.wt. and 60-400 pts.wt.; the curing accelerator included therein includes a composition including an imidazole compound and a phosphorous acid compound. |
