发明名称 |
JOINT STRUCTURE OF ALUMINUM MEMBER AND COPPER MEMBER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a joint structure of an aluminum member and a copper member in which an aluminum member made of aluminum or an aluminum alloy and a copper member made of copper or a copper alloy are relatively easily and surely joined with each other, and which has sufficient joint reliability to be applied to an electronic/electrical component, a heat radiation component and the like.SOLUTION: An aluminum member 11 made of aluminum or an aluminum alloy and a copper member 12 made of copper or a copper alloy are joined with each other by solid phase diffusion bonding. A joint interface between the aluminum member 11 and the copper member 12 is formed with an intermetallic compound layer 21 comprising Cu and Al. Oxides 27 are dispersed in a layered state along an interface between the copper member 12 and the intermetallic compound layer 21.</p> |
申请公布号 |
JP2014076486(A) |
申请公布日期 |
2014.05.01 |
申请号 |
JP20130193431 |
申请日期 |
2013.09.18 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI |
分类号 |
B23K20/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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