| 摘要 |
<p>The purpose of the present invention is to provide an active energy ray-curable adhesive composition which exhibits excellent heat resistance, film hardness and adhesion after being irradiated with an active energy ray. An active energy ray-curable adhesive composition of the present invention contains component (A), component (B), component (D), component (E), and optionally component (C). In the total of the components (A)-(C), 40-90% by weight of the component (A), 10-60% by weight of the component (B) and 0-20% by weight of the component (C) are contained. Relative to 100 parts by weight of the total of the components (A)-(C), 0.05-10 parts by weight of the component (D) and 0.01-3 parts by weight of the component (E) are contained. Component (A): a polymer which contains a maleimide group and a polar group and has a glass transition temperature of more than 0°C but 40°C or less Component (B): a compound which has two or more ethylenically unsaturated groups in each molecule Component (C): a compound which has one ethylenically unsaturated group in each molecule Component (D): a photopolymerization initiator and/or a sensitizer Component (E): a thermosetting crosslinking agent</p> |
