发明名称 SILICON EPITAXIAL WAFER AND MANUFACTURING METHOD OF SOLID STATE IMAGING ELEMENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a silicon epitaxial wafer which has gettering capability in order to prevent dark current and a white spot at the time of forming a solid state imaging element, and which reduces crystal defects; and provide a manufacturing method of a solid state imaging element using the silicon epitaxial wafer.SOLUTION: In a silicon epitaxial wafer where an epitaxial layer is formed on a silicon single crystal substrate 10, a concentration of carbon which forms a solid solution in the epitaxial layer is set at not less than 5×10atoms/cmand not more than 5×10atoms/cm.
申请公布号 JP2014078667(A) 申请公布日期 2014.05.01
申请号 JP20120226985 申请日期 2012.10.12
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 OTSUKI TAKESHI
分类号 H01L21/205;H01L21/322;H01L21/324;H01L27/146 主分类号 H01L21/205
代理机构 代理人
主权项
地址