发明名称 |
SILICON EPITAXIAL WAFER AND MANUFACTURING METHOD OF SOLID STATE IMAGING ELEMENT USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a silicon epitaxial wafer which has gettering capability in order to prevent dark current and a white spot at the time of forming a solid state imaging element, and which reduces crystal defects; and provide a manufacturing method of a solid state imaging element using the silicon epitaxial wafer.SOLUTION: In a silicon epitaxial wafer where an epitaxial layer is formed on a silicon single crystal substrate 10, a concentration of carbon which forms a solid solution in the epitaxial layer is set at not less than 5×10atoms/cmand not more than 5×10atoms/cm. |
申请公布号 |
JP2014078667(A) |
申请公布日期 |
2014.05.01 |
申请号 |
JP20120226985 |
申请日期 |
2012.10.12 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
OTSUKI TAKESHI |
分类号 |
H01L21/205;H01L21/322;H01L21/324;H01L27/146 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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