| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus handing a high packaging density double-sided mounting board capable of reliably avoiding interference between lower receiving pins and mounted components and a board positioning method in the electronic component mounting apparatus.SOLUTION: The electronic component mounting apparatus controls a board conveying mechanism 3 to stop a board 4 at a target stop position E on a mounting stage [S]. A board recognition camera 11 which moves together with the mounting head recognizes a position detection portion formed on the stopped board 4 to detect a displacement error from the target stop position E. The electronic component mounting apparatus controls the board conveying mechanism 3 to correct the detected displacement error. After performing a displacement correction so that the stop position of the board 4 coincide with the target stop position E, lower receiving pins 15c is raised to support the board 4 with no displacement error from the bottom thereof.</p> |
