| 摘要 |
A testing environment is provided in which both accelerometers and magnetometers can be tested in parallel, thereby decreasing the total cycle time for testing a semiconductor device package containing those devices. Embodiments of the present invention can also be configured to test singulated packages, thereby providing a tested and trimmed product that more accurately reflects the package delivered to the customer. In one embodiment, a series of device test locations within a testing region are configured to provide a known relationship with multiple fields of force. The device test locations are configured to provide sensitivity data from the packaged sensors in response to the directional forces. Embodiments provide a mechanism to transport the sensor packages from a device test location to a next device test location. |
