PRESSURE-SENSITIVE ADHESIVE FILM

摘要

Provided is a pressure-sensitive adhesive film suitable for an application involving cutting with a short-wavelength laser having a center wavelength of 1.0μm to 1.1μm. A pressure-sensitive adhesive film 1 according to the present invention comprises a resin film 10 as a substrate, and a pressure-sensitive adhesive layer 20 provided at least on a first face of resin film 10. Substrate 10 has a laser beam absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm, and comprises a laser beam-absorbing layer 42 formed from a resin composition that comprises a carbon black 402 as a laser beam-absorbing agent that increases the laser beam absorbance.