| 发明名称 |
Bump Interconnection Ratio for Robust CPI Window |
| 摘要 |
The disclosure is directed to a device and method for manufacture thereof. The device includes a first workpiece bonded to a second workpiece by a bump interconnection structure. The bump interconnection structure allows for optimized packaging assembly yield and bond integrity. |
| 申请公布号 |
US2014117532(A1) |
申请公布日期 |
2014.05.01 |
| 申请号 |
US201213660441 |
申请日期 |
2012.10.25 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHUANG CHITA;CHUANG YAO-CHUN;HSU YU-CHEN;TSENG MING HUNG;CHEN CHEN-SHIEN |
| 分类号 |
H01L23/485;H01L21/60 |
主分类号 |
H01L23/485 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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