NOVEL ELECTRONIC CIRCUIT REINFORCING AGENT

摘要

Provided are: a photocurable electronic circuit reinforcing agent which exhibits excellent adhesion to a substrate surface formed of glass, a polyimide or the like, while having excellent electronic circuit reinforcing properties; and an electronic component which is reinforced using this electronic circuit reinforcing agent. An electronic circuit reinforcing agent of the present invention contains (1) an epoxy (meth)acrylate, (2) a urethane (meth)acrylate, and (3) a (meth)acryloyl group-containing compound which does not contain a silicon atom (excluding a compound that belongs to component (1) or component (2)). The urethane (meth)acrylate (2) preferably contains a structure that is derived from a polyester polyol which has a structural unit derived from a hydrogenated dimer acid and a structural unit derived from a hydrogenated dimer diol.