| 摘要 |
<p>Provided is a polyamide-imide resin composition that makes it possible to form a resin film that is unlikely to absorb moisture and that exhibits little dimensional change resulting from moisture absorption. The polyamide-imide resin composition of the present invention comprises a polyamide-imide resin (A) and a compound (B) having a C=O group, a S=O group, or a P=O group. The ratio B/A of the number B of moles of the compound (B) to the number A of amide bonds in the polyamide-imide resin (A) within the polyamide-imide resin composition is 0.1-0.7.</p> |
