| 摘要 |
<p>In order to provide a light-emitting device that is able to reduce the amount of light captured inside a coating film and improve the efficiency with which light emitted from a LED chip is extracted even when a coating film is provided for preventing oxidation or sulfuration of a metallic film, the light-emitting device is provided with a substrate (1), a metallic film (2) formed on the surface of the substrate (1), a LED chip (4) provided on the metallic film (2), and a coating film (3) formed on the metallic film. The coating film (3) has formed therein a through-hole (31) that penetrates in the thickness direction of the film and has the LED chip (4) disposed therein. As viewed from above, the through-hole (31) is formed larger than the LED chip (4), a gap being formed between the external peripheral surface of the LED chip (4) and the internal peripheral surface of the through-hole.</p> |
