| 摘要 |
A method of bonding a fluoroelastomer to a metal substrate, said method comprises:
i) providing a fluoroelastomer compound comprising a) a fluoroelastomer that is curable by a bisphenol and/or peroxide curing agent, and b) a curing agent with which the fluoroelastomer can be cured, and bringing the fluoroelastomer compound in contact with the metal substrate to form a common interface,
ii) curing the fluoroelastomer compound in the presence of an effective amount of at least one bonding promoter, wherein the bonding promoter has a molecular weight of less than 5,000 g/mole and a boiling point of at least 150 °C at 760 Torr and is selected from saturated aliphatic or aromatic hydroxy ethers, and anhydrides or esters of carbonates, carboxylic acids and phosphoric acids. Also provided are fluoropolymer compounds comprising the fluoroelastomer, the curing agent and the bonding promoter and a composite material obtained by curing the compound. Further provided is the use of the bonding promoter for increasing the bond strength between a fluoroelastomer and a metal substrate. |
