| 摘要 |
<p>The present invention relates to a multilayered printed circuit board and a semiconductor package using the same. The multilayered printed circuit board according to the present invention includes: a core layer including a core insulation layer having first circuit patterns on upper and lower surfaces thereof and having a first via hole electrically connecting the first circuit patterns on the upper and lower surfaces thereof; first and second insulation layers formed on the upper and lower surfaces of the first circuit patterns, respectively, and having a second via hole; a lead frame formed on an upper surface of the first insulation layer; a second circuit pattern formed on a lower surface of the second insulation layer; and PSR (Photo Solder Resist) layers formed on an upper surface of the lead frame and a lower surface of the second circuit pattern. According to the present invention, a wire can be bonded at a free location and the number of inputs and outputs can be increased when a lead out terminal is rewired.</p> |
