发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND USE OF THE SAME FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A DISPLAY |
摘要 |
<p>Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (C) a compound having two or more oxetanyl groups in one molecule and (D) a catalyst for accelerating the ring-opening reaction of the oxetanyl groups of the compound (C).</p> |
申请公布号 |
EP1965256(B1) |
申请公布日期 |
2014.04.30 |
申请号 |
EP20060832830 |
申请日期 |
2006.11.17 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
BANBA, TOSHIO;MIZUSHIMA, AYAKO |
分类号 |
G03F7/075;G03F7/004;G03F7/023;G03F7/40;H01L21/027 |
主分类号 |
G03F7/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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