发明名称 JIG FOR BONDING WIRES ON BOARD
摘要 The purpose of the present invention is to provide a jig for wire bonding of a board which improves process efficiency and quickly and accurately fixes a wire to a low boning position by easily and quickly fixing the wire to a bonding position by a sliding method according to pulling and releasing a support unit by user′s hands. Particularly, another purpose of the present invention is to provide a jig for wire bonding of a board which is appropriately used according to a wire bonding method by sorting the support unit into a slide type and a pin type by using an elastic spring according to a composition such as one end of a wire, an elect-type or both sides, and a terminal.
申请公布号 KR101390720(B1) 申请公布日期 2014.04.30
申请号 KR20130019362 申请日期 2013.02.22
申请人 INNOREX TECHNOLOGIES 发明人 SEO, SANG BOK
分类号 H01L21/60;B23K3/00;H05K3/34 主分类号 H01L21/60
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