发明名称 Verfahren zum Herstellen von mindestens zwei auf einer Oberflaeche des Halbleiterkoerpers eines Halbleiterbauelementes dicht nebeneinander angebrachten Legierungselektroden
摘要 1,014,518. Semi-conductor devices. INTERMETALL GESELLSCHAFT FUR METALLURGIE UND ELEKTRONIK. Jan. 23, 1963 [Feb. 5, 1962], No. 2820/63. Heading H1K. Alloyed electrodes on a semi-conductor body are provided by applying the electrode material to the body, covering this and the body with a layer of insulating material containing silicon oxide and then alloying the material into the body; the insulating material thus limits the area of the alloying surface. The material may be arranged to peel off the electrode after the alloying process to allow for connections. The insulating layer may consist of a mixture of of SiO and Al 2 O or of SiO and B 2 O 3 , or of pure SiO 2 obtained by vaporization or cathodic atomization of Si in oxygen. The semiconductor material may be germanium and the process is suitable for transistors.
申请公布号 DE1174909(B) 申请公布日期 1964.07.30
申请号 DE1962J021258 申请日期 1962.02.05
申请人 INTERMETALL GESELLSCHAFT FUER METALLURGIE;ELEKTRONIK M.B.H. 发明人 DAHLBERG DR. REINHARD
分类号 H01L21/00;H01L23/29 主分类号 H01L21/00
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