摘要 |
<p>The purpose of the present invention is to provide a bonding method using the wire bonding jig of a board which improves process efficiency and quickly and accurately fixes a wire to a low boning position by easily and quickly fixing the wire to a bonding position by a sliding method according to pulling and releasing a support unit by user′s hands. Particularly, another purpose of the present invention is to provide a bonding method using the wire bonding jig of a board which is appropriately used according to a wire bonding method by sorting the support unit into a slide type and a pin type by using an elastic spring according to a composition such as one end of a wire, an elect-type or both sides.</p> |