发明名称 High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
摘要 A high-dielectric sheet for a printed circuit board includes a first electrode, a first sputter film formed on the first electrode, an intermediate layer formed on the first sputter film by calcining a sol-gel film, a second sputter film formed on the intermediate layer, and a second electrode provided on the second sputter film.
申请公布号 US8707552(B2) 申请公布日期 2014.04.29
申请号 US20060580927 申请日期 2006.10.16
申请人 KARIYA TAKASHI;TANAKA HIRONORI;IBIDEN CO., LTD. 发明人 KARIYA TAKASHI;TANAKA HIRONORI
分类号 H05K3/30 主分类号 H05K3/30
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