CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION FOR FORMING SOLDER RESIST, CURED FILM, AND PRINTED CIRCUIT BOARD

摘要

The present invention provides: a curable resin composition with excellent hiding power and high reflexibility, capable of obtaining a coated film where the decrease of reflexibility due to thermal history is controlled; a curable resin composition specifically for forming a solder resist; a cured film obtained from the composition; and a printed circuit board. The curable resin composition of the present invention contains an organic binder and titanium oxide, and additionally contains a blue inorganic coloring agent. [Reference numerals] (AA) Example 3 Reflectance graph; (BB) Reflectance(%); (CC) Wavelength; (DD) Example 3 Initial stage; (EE) Example 3 After heating