| 摘要 |
A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending. The adhesive material can be a material containing conductive particles therein. Further, the substrate of the flexible circuit cable can be of such a design that a shielding layer is included and in electrical connection with a grounding line, whereby the shielding layer enclosing each of the lapped flat cable components in the water resistant structure is electrically connected to the water resistant component containing a conductive substance or the device enclosure to realize protection against electromagnetic interference. |
