发明名称 |
Adaptive flow for thermal cooling of devices |
摘要 |
A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path. |
申请公布号 |
US8712598(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201113006797 |
申请日期 |
2011.01.14 |
申请人 |
DIGHDE RAJESH MANOHAR;SCHULTZ BERNIE;ABZARIAN DAVID;MICROSOFT CORPORATION |
发明人 |
DIGHDE RAJESH MANOHAR;SCHULTZ BERNIE;ABZARIAN DAVID |
分类号 |
G05D23/00;G06F1/20;H01L23/473;H05K7/20 |
主分类号 |
G05D23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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