发明名称 |
Semiconductor assembly and semiconductor package including a solder channel |
摘要 |
Semiconductor packages connecting a semiconductor chip to an external device by bumps are provided. The semiconductor packages may include a connection pad on a semiconductor chip, a connecting bump on and configured to be electrically connected to the connection pad and a supporting bump on the semiconductor chip and configured to be electrically isolated from the connection pad. The connection bump may include a first pillar and a first solder ball and the supporting bump may include a second pillar and a second solder ball. The semiconductor packages may further include a solder channel in the second pillar configured to allow a portion of the second solder ball to extend into the solder channel along a predetermined direction. |
申请公布号 |
US8710657(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201113242864 |
申请日期 |
2011.09.23 |
申请人 |
PARK JEONG-WOO;CHO MOON-GI;LEE UI-HYOUNG;PARK SUN-HEE;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK JEONG-WOO;CHO MOON-GI;LEE UI-HYOUNG;PARK SUN-HEE |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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