发明名称 High-density 3-dimensional structure
摘要 A 3-D structure formed in a recess of a substrate delimited by walls, including a large number of rectangle parallelepipedic blades extending from the bottom of the recess to the substrate surface while being oriented perpendicularly to one another and formed in a pattern covering the whole surface of the recess, some blades being non-secant to one of the walls, each non-secant blade being connected to one of the walls by at least another perpendicular blade.
申请公布号 US8710598(B2) 申请公布日期 2014.04.29
申请号 US20090552032 申请日期 2009.09.01
申请人 MORAND JEAN-LUC;STMICROELECTRONICS (TOURS) SAS 发明人 MORAND JEAN-LUC
分类号 H01L29/82 主分类号 H01L29/82
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