Component temperature control

摘要

There is disclosed an electronic apparatus comprising a chip within a casing. A thermoelectric cooler has thermal connections to the chip and the casing and is configured to transport heat from the chip to the casing. A temperature measuring device is provided for determining the temperature of the chip. A control system is configured to maintain the chip at a target temperature by controlling current supplied to the thermoelectric cooler in response to the measured temperature. A temperature selection system is configured to select the chip target temperature dynamically on the basis of the casing temperature.