发明名称 |
LEAD-FREE SOLDER COMPOSITIONS |
摘要 |
<p>A solder may include zinc, aluminum, magnesium and gallium. The zinc may be present in an amount from about 82% to 96% by weight of the solder. The aluminum may be present in an amount from about 3% to about 15% by weight of the solder. The magnesium may be present in an amount from about 0.5% to about 1.5% by weight of the solder. The gallium may be present in an amount between about 0.5% to about 1.5% by weight of the solder.</p> |
申请公布号 |
KR20140050728(A) |
申请公布日期 |
2014.04.29 |
申请号 |
KR20147006835 |
申请日期 |
2012.08.17 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
LI JIANXING;PINTER MICHAEL R.;STEELE DAVID E. |
分类号 |
B23K35/22;B23K35/28;C22C18/04 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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