发明名称 LEAD-FREE SOLDER COMPOSITIONS
摘要 <p>A solder may include zinc, aluminum, magnesium and gallium. The zinc may be present in an amount from about 82% to 96% by weight of the solder. The aluminum may be present in an amount from about 3% to about 15% by weight of the solder. The magnesium may be present in an amount from about 0.5% to about 1.5% by weight of the solder. The gallium may be present in an amount between about 0.5% to about 1.5% by weight of the solder.</p>
申请公布号 KR20140050728(A) 申请公布日期 2014.04.29
申请号 KR20147006835 申请日期 2012.08.17
申请人 HONEYWELL INTERNATIONAL INC. 发明人 LI JIANXING;PINTER MICHAEL R.;STEELE DAVID E.
分类号 B23K35/22;B23K35/28;C22C18/04 主分类号 B23K35/22
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