| 发明名称 |
Device and method including a soldering process |
| 摘要 |
A device and method of making a device is disclosed. One embodiment provides a substrate. A semiconductor chip is provided having a first surface with a roughness of at least 100 nm. A diffusion soldering process is performed to join the first surface of the semiconductor chip to the substrate. |
| 申请公布号 |
US8710678(B2) |
申请公布日期 |
2014.04.29 |
| 申请号 |
US201213541138 |
申请日期 |
2012.07.03 |
| 申请人 |
GANITZER PAUL;SANTOS RODRIGUEZ FRANCISCO JAVIER;SPORN MARTIN;KRAFT DANIEL;INFINEON TECHNOLOGIES AG |
发明人 |
GANITZER PAUL;SANTOS RODRIGUEZ FRANCISCO JAVIER;SPORN MARTIN;KRAFT DANIEL |
| 分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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