发明名称 |
Power surface mount light emitting die package |
摘要 |
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface. |
申请公布号 |
US8710514(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201213481334 |
申请日期 |
2012.05.25 |
申请人 |
ANDREWS PETER SCOTT;LOH BAN P.;CREE, INC. |
发明人 |
ANDREWS PETER SCOTT;LOH BAN P. |
分类号 |
H01L27/15;H01L29/22;H01L29/227;H01L29/24;H01L33/48;H01L33/54;H01L33/58;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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