| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening. |
